The Confocal NEXIV, a ground-breaking Multi-Functional video measuring system, was developed on the strength of Nikon’s leading opto-mechatronics technologies.

It incorporates confocal technology, brightfield with a 15X zoom, and TTL Laser AF. No matter what geometrical measurements you need–two-dimensional or three-dimensional–inspection and evaluation is exceptionally fast and accurate with this system!

The Confocal NEXIV can be optimally used for measurements of a variety of bump heights on advanced IC packages such as wafer-level CSP, as well as for the inspection of highly complicated structures of MEMS and probe card.

Features

• Simultaneous wide-area height measurements with Nikon proprietary confocal optics
• 2D measurement with 15x brightfield zoom optics
• Fully compatible with 300mm wafer measurement at semiconductor fabs

Applications

• IC Packages
  • Flip Chip/COF(Bump)/COG
  • CSP (FBGA)/SIP (Bump, Wire)
  • Interposer (Pad height)
• MEMS
• Probe Card (Silicon Probe, Au Probe)
• Precise Glass Components (Micro Lens, Contact Lens)
• Photo Spacer Width/Height for Color Filter for FPD Panel